Die bonder

Die bonders are core equipment for semiconductor packaging. They pick, position and bond dies from wafers onto substrates or lead frames, and are essential for the packaging of LEDs, ICs and power devices.

The key process requirements include high-precision positioning, high-speed mounting and low-damage operation. Mounting accuracy determines the alignment between dies and substrates, while mounting speed governs production efficiency. Meanwhile, suction force and bonding temperature must be precisely regulated to prevent die cracking or delamination.

MT’s solution combines high-precision servo systems and motion control. Equipped with high-resolution servo motors featuring 23-bit absolute encoders and linear motor stages, it delivers micron-level motion control. Integrated motion control algorithms enable dynamic compensation for consistent mounting accuracy. A built-in closed-loop pressure control system uses force sensors to monitor bonding force in real time and protect dies from damage. It supports multi-station parallel operation to synchronize feeding, dispensing, mounting and curing processes, greatly boosting overall throughput.

Applicable Products: MC801(MC800 series), MB6, M930(M900 series)