Prober

Probers are wafer-level testing equipment. Probes make contact with electrodes on wafer dies to conduct electrical testing before wafer dicing, serving as a critical link between wafer fabrication and packaging.

Core technical difficulties are probe positioning accuracy and contact force control. The alignment precision between probes and die electrodes needs to reach the micron level. Excessive contact force will damage electrodes, while insufficient force leads to poor contact and inaccurate test results.

MT’s high-precision motion control solution adopts precision servo motors to drive the X/Y/Z axes of the prober, paired with linear guides and linear scale feedback. The built-in closed-loop force control algorithm uses force sensors to monitor probe contact pressure in real time and dynamically adjust Z-axis servo output to maintain pressure within the required range. It also supports automatic wafer alignment and calibration. The vision positioning system identifies alignment marks on wafers to achieve accurate positioning.

Applicable Products: MC501(MC500 series), MB6, M930(M900 series)